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박장웅

Park, Jang-Ung
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Stamp collapse in soft lithography

Author(s)
Huang, YGYZhou, WXHsia, KJMenard, EPark, Jang-UngRogers, JAAlleyne, AG
Issued Date
2005-08
DOI
10.1021/la0502185
URI
https://scholarworks.unist.ac.kr/handle/201301/7739
Fulltext
http://www.scopus.com/inward/record.url?partnerID=HzOxMe3b&scp=29144450768
Citation
LANGMUIR, v.21, no.17, pp.8058 - 8068
Abstract
We have studied the so-called roof collapse in soft lithography. Roof collapse is due to the adhesion between the PDMS stamp and substrate, and it may affect the quality of soft lithography. Our analysis accounts for the interactions of multiple punches and the effect of elastic mismatch between the PDMS stamp and substrate. A scaling law among the stamp modulus, punch height and spacing, and work of adhesion between the stamp and substrate is established. Such a scaling law leads to a simple criterion against the unwanted roof collapse. The present study agrees well with the experimental data.
Publisher
AMER CHEMICAL SOC
ISSN
0743-7463

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