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김주영

Kim, Ju-Young
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Stress-strain curves of flip-chip solder balls based on finite-element modeling of thermal displacements measured by electronic speckle pattern interferometry

Author(s)
Lee, BWKim, Ju-YoungKwon, D
Issued Date
2003-12
DOI
10.1007/s11664-003-0030-5
URI
https://scholarworks.unist.ac.kr/handle/201301/7686
Fulltext
http://www.scopus.com/inward/record.url?partnerID=HzOxMe3b&scp=0347477195
Citation
JOURNAL OF ELECTRONIC MATERIALS, v.32, no.11, pp.1322 - 1329
Abstract
Electronic speckle pattern interferometry (ESPI) was applied to noncontact, real-time evaluation of thermal deformation in a flip-chip solder joint. To measure the deformation of such tiny components as the solder balls in the flip-chip, the spatial resolution of ESPI was increased to submicron scale by magnifying the areas studied. Experimental-computational procedures were developed to obtain stress-strain curves for solder balls in the flip-chip based on finite-element modeling (FEM) of in-plane ESPI thermal displacement data. The stress-strain curve obtained for the flip-chip solder was compared with those for bulk solder. The microstructure was also studied to clarify the stress-strain curve results.
Publisher
SPRINGER
ISSN
0361-5235

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