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Jeong, Hoon Eui
Multiscale Biomimetics and Manufacturing Lab.
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dc.citation.endPage 5380 -
dc.citation.number 19 -
dc.citation.startPage 5375 -
dc.citation.title SOFT MATTER -
dc.citation.volume 8 -
dc.contributor.author Jeong, Hoon Eui -
dc.contributor.author Suh, Kahp-Yang -
dc.date.accessioned 2023-12-22T05:09:44Z -
dc.date.available 2023-12-22T05:09:44Z -
dc.date.created 2014-10-17 -
dc.date.issued 2012-05 -
dc.description.abstract We present a simple, yet robust, technique for controlling the tip geometry of nanopillars by utilizing a two-step process of partial photopolymerization of UV-curable polyurethane acrylate (PUA) resin and subsequent tip shape modification. With this technique, head structures of nanopillars were precisely transformed from hemispherical to protruding, mushroom-like tips without any loss in structural integrity of the nanopillars. Nanoscopic and macroscopic adhesion measurements for angled nanopillars with modified tips demonstrated that mushroom-like structures fabricated by our approach could greatly enhance adhesion strengths as compared to unmodified, round head structures. Also, directional adhesion characteristics of angled nanopillars were maintained regardless of tip shapes. -
dc.identifier.bibliographicCitation SOFT MATTER, v.8, no.19, pp.5375 - 5380 -
dc.identifier.doi 10.1039/c2sm07440k -
dc.identifier.issn 1744-683X -
dc.identifier.scopusid 2-s2.0-84860356674 -
dc.identifier.uri https://scholarworks.unist.ac.kr/handle/201301/7350 -
dc.identifier.url http://pubs.rsc.org/en/Content/ArticleLanding/2012/SM/c2sm07440k#!divAbstract -
dc.identifier.wosid 000303208700033 -
dc.language 영어 -
dc.publisher ROYAL SOC CHEMISTRY -
dc.title Precise tip shape transformation of nanopillars for enhanced dry adhesion strength -
dc.type Article -
dc.description.journalRegisteredClass scie -
dc.description.journalRegisteredClass scopus -
dc.subject.keywordPlus CAPILLARY-FORCE LITHOGRAPHY -
dc.subject.keywordPlus SURFACE-ENERGY -
dc.subject.keywordPlus CONTACT SHAPE -
dc.subject.keywordPlus GECKO SETAE -
dc.subject.keywordPlus MICROSTRUCTURE -
dc.subject.keywordPlus DEVICES -
dc.subject.keywordPlus ARRAYS -

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