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Liquid Metal-Based Electronic Packaging Technologies for Highly Integrated Soft Electronics
- Author(s)
- Park, Young-Geun
- Advisor
- Song, Myoung Hoon
- Issued Date
- 2020-08
- URI
- https://scholarworks.unist.ac.kr/handle/201301/73112 http://unist.dcollection.net/common/orgView/200000337589
- Publisher
- Ulsan National Institute of Science and Technology (UNIST)
- Degree
- Doctor
- Major
- Department of Materials Science and Engineering
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