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Jeong, Changwook
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dc.citation.conferencePlace JA -
dc.citation.conferencePlace Kyoto -
dc.citation.endPage 99 -
dc.citation.startPage 98 -
dc.citation.title 2005 Symposium on VLSI Technology -
dc.contributor.author Ahn, S.J. -
dc.contributor.author Hwang, Y.N. -
dc.contributor.author Song, Y.J. -
dc.contributor.author Lee, S.H. -
dc.contributor.author Lee, S.Y. -
dc.contributor.author Park, J.H. -
dc.contributor.author Jeong, Changwook -
dc.contributor.author Ryoo, K.C. -
dc.contributor.author Shin, J.M. -
dc.contributor.author Fai, Y. -
dc.contributor.author Oh, J.H. -
dc.contributor.author Koh, G.H. -
dc.contributor.author Jeong, G.T. -
dc.contributor.author Joo, S.H. -
dc.contributor.author Choi, S.H. -
dc.contributor.author Son, Y.H. -
dc.contributor.author Shin, J.C. -
dc.contributor.author Kim, Y.T. -
dc.contributor.author Jeong, H.S. -
dc.contributor.author Kim, K. -
dc.date.accessioned 2023-12-20T05:36:30Z -
dc.date.available 2023-12-20T05:36:30Z -
dc.date.created 2022-04-06 -
dc.date.issued 2005-06-14 -
dc.description.abstract Novel small contact fabrication technologies were proposed to realize reliable high density 256Mb PRAM(Phase Change Memory) product. Introducing the 2-step CMP (Chemical Mechanical Polishing) process and the ring-shaped contact structure, the contact area distribution was greatly improved even at the smallest contact diameter of 50nm node. The validity of this approach was directly confirmed by the evaluation of the functionality for the fabricated 256Mbit PRAM based on 0. 10μm CMOS technology. -
dc.identifier.bibliographicCitation 2005 Symposium on VLSI Technology, pp.98 - 99 -
dc.identifier.doi 10.1109/.2005.1469227 -
dc.identifier.issn 0743-1562 -
dc.identifier.scopusid 2-s2.0-30344435158 -
dc.identifier.uri https://scholarworks.unist.ac.kr/handle/201301/58537 -
dc.language 영어 -
dc.publisher 2005 Symposium on VLSI Technology -
dc.title Highly reliable 50nm contact cell technology for 256Mb PRAM -
dc.type Conference Paper -
dc.date.conferenceDate 2005-06-14 -

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