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Madou, Mark
BIO-MEMS Lab
Research Interests
  • Medical Diagnostics

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An additive micromolding approach for the development of micromachined ceramic substrates for RF applications

Cited 3 times inthomson ciCited 6 times inthomson ci
Title
An additive micromolding approach for the development of micromachined ceramic substrates for RF applications
Author
Vaed, KFlorkey, JAkbar, SAMadou, MarkLannutti, JJCahill, SS
Keywords
anisotropic etching; ceramic micromachining; green tape; LTCC; MEMS; molding; radio frequency (RF); surface profiler; transmission lines KeyWords Plus:SILICON; FABRICATION; MICROWAVE; MICROSTRUCTURES; TOOL
Issue Date
200406
Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
Citation
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, v.13, no.3, pp.514 - 525
Abstract
The selective removal of the substrate from under devices can help improve Q-factors, reduce losses and parasitics and can be applied to microwave components (transmission lines, spiral inductors, and capacitors) critical to high-frequency communications systems. A novel molding process has been developed to produce cavities in ceramic substrates over which gold transmission,lines can be suspended. The "additive" method of fabricating cavities in ceramics was primarily based on the production of a substrate with preexisting cavities, as opposed to generation of cavities by the removal or the "subtraction" of material. The preexisting cavities were generated using a transfer mold technique based on photolithography, anisotropic silicon etching and nickel electroplating. The approach was demonstrated successfully using a commercial glass ceramic material (DuPont 951 Green Tape) to yield 100-mum-deep cavities that showed shape retention and dimensional stability.
URI
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DOI
http://dx.doi.org/10.1109/JMEMS.2004.828737
ISSN
1057-7157
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