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Author

Lee, Zonghoon
Atomic-Scale Electron Microscopy (ASEM) Lab
Research Interests
  • Advanced Transmission Electron Microscopy (TEM/STEM), in Situ TEM, graphene, 2D materials, low-dimensional crystals, nanostructured materials

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Microstructural evolution and deformation of cryomilled nanocrystalline Al-Ti-Cu alloy

Cited 30 times inthomson ciCited 33 times inthomson ci
Title
Microstructural evolution and deformation of cryomilled nanocrystalline Al-Ti-Cu alloy
Author
Lee, ZonghoonRodriguez, RHayes, RWLavernia, EJNutt, SR
Keywords
Engineering controlled terms: Deformation; Extrusion; Fracture; Metallographic microstructure; Nanostructured materials; Plastic deformation
Issue Date
200307
Publisher
SPRINGER
Citation
METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, v.34A, no.7, pp.1473 - 1481
Abstract
The microstructural evolution during processing and tensile deformation of a nanocrystalline Al-Ti-Cu alloy was investigated using transmission and scanning electron microscopy. Grain refinement was achieved by cryomilling of elemental powders, and powders were consolidated by hot isostatic pressing ("HIPing") followed by extrusion to produce bulk nanocrystalline Al-Ti-Cu alloys. In an effort to enhance ductility and toughness of nanocrystalline metals, multiscale structures were produced that consisted of nanocrystalline grains and elongated coarse-grain (CG) bands of pure aluminum. Examination of bulk tensile fracture samples revealed unusual failure mechanisms and interactions between the CG bands and nanocrystalline regions. The ductile CG bands underwent extensive plastic deformation prior to fracture, while nanocrystalline regions exhibited nucleation and growth of voids and microcracks. Cracks tended to propagate from nanocrystalline regions to the CG bands, where they were effectively arrested by a combination of crack blunting and crack bridging. These processes were instrumental in enhancing the toughness and ductility of the nanocrystalline alloy.
URI
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DOI
http://dx.doi.org/10.1007/s11661-003-0259-x
ISSN
1073-5623
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