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| DC Field | Value | Language |
|---|---|---|
| dc.citation.conferencePlace | KO | - |
| dc.citation.title | IEEE SLIP 2013 | - |
| dc.contributor.author | Kim, Youngmin | - |
| dc.contributor.author | Im, Young Hyun | - |
| dc.contributor.author | Han, Ki Jin | - |
| dc.date.accessioned | 2023-12-20T01:35:57Z | - |
| dc.date.available | 2023-12-20T01:35:57Z | - |
| dc.date.created | 2014-04-14 | - |
| dc.date.issued | 2013 | - |
| dc.identifier.bibliographicCitation | IEEE SLIP 2013 | - |
| dc.identifier.uri | https://scholarworks.unist.ac.kr/handle/201301/45848 | - |
| dc.language | 영어 | - |
| dc.publisher | IEEE | - |
| dc.title | Performance Analysis for Interconnections of 3D IC Considering Frequency Dependent Effect of TSVs | - |
| dc.type | Conference Paper | - |
| dc.date.conferenceDate | 2013 | - |
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