BROWSE

Related Researcher

Author

Lee, Sukbin
Multidimensional Structural Materials Lab
Research Interests
  • Microstructural evolution, advanced characterization, computational materials science, 3D materials science, microstructure-property relation

ITEM VIEW & DOWNLOAD

Interfacial orientation and misorientation relationships in nanolamellar Cu/Nb composites using transmission-electron-microscope-based orientation and phase mapping

Cited 3 times inthomson ciCited 1 times inthomson ci
Title
Interfacial orientation and misorientation relationships in nanolamellar Cu/Nb composites using transmission-electron-microscope-based orientation and phase mapping
Author
Liu, X.Nuhfer, N.T.Rollett, A.D.Sinha, S.Lee, SukbinCarpenter, J.S.LeDonne, J.E.Darbal, A.Barmak, K.
Keywords
Accumulative roll bonding (ARB); Heterophase interface character distribution (HICD); Interface structure; Orientation relation (OR); Transmission electron microscopy (TEM)
Issue Date
201402
Publisher
PERGAMON-ELSEVIER SCIENCE LTD
Citation
ACTA MATERIALIA, v.64, no., pp.333 - 344
Abstract
A transmission-electron-microscope-based orientation mapping technique that makes use of beam precession to achieve near-kinematical conditions was used to map the phase and crystal orientations in nanolamellar Cu/Nb composites with average layer thicknesses of 86, 30 and 18 nm. Maps of high quality and reliability were obtained by comparing the recorded diffraction patterns with pre-calculated templates. Particular care was taken in optimizing the dewarping parameters and in calibrating the frames of reference. Layers with thicknesses as low as 4 nm were successfully mapped. Heterophase interface plane and character distributions (HIPD and HICD, respectively) of Cu and Nb phases from the samples were determined from the orientation maps. In addition, local orientation relation stereograms of the Cu/Nb interfaces were calculated, and these revealed the detailed layer-to-layer texture information. The results are in agreement with previously reported neutron-diffraction-based and precession-electron-diffraction-based measurements on an accumulated roll bonding (ARB)-fabricated Cu/Nb sample with an average layer thickness of 30 nm as well as scanning-electron-microscope-based electron backscattered diffraction HIPD/HICD plots of ARB-fabricated Cu/Nb samples with layer thicknesses between 200 and 600 nm.
URI
Go to Link
DOI
http://dx.doi.org/10.1016/j.actamat.2013.10.046
ISSN
1359-6454
Appears in Collections:
MSE_Journal Papers

find_unist can give you direct access to the published full text of this article. (UNISTARs only)

Show full item record

qr_code

  • mendeley

    citeulike

Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.

MENU