Interfacial orientation and misorientation relationships in nanolamellar Cu/Nb composites using transmission-electron-microscope-based orientation and phase mapping
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- Interfacial orientation and misorientation relationships in nanolamellar Cu/Nb composites using transmission-electron-microscope-based orientation and phase mapping
- Liu, X.; Nuhfer, N.T.; Rollett, A.D.; Sinha, S.; Lee, Sukbin; Carpenter, J.S.; LeDonne, J.E.; Darbal, A.; Barmak, K.
- Accumulative roll bonding (ARB); Heterophase interface character distribution (HICD); Interface structure; Orientation relation (OR); Transmission electron microscopy (TEM)
- Issue Date
- PERGAMON-ELSEVIER SCIENCE LTD
- ACTA MATERIALIA, v.64, no., pp.333 - 344
- A transmission-electron-microscope-based orientation mapping technique that makes use of beam precession to achieve near-kinematical conditions was used to map the phase and crystal orientations in nanolamellar Cu/Nb composites with average layer thicknesses of 86, 30 and 18 nm. Maps of high quality and reliability were obtained by comparing the recorded diffraction patterns with pre-calculated templates. Particular care was taken in optimizing the dewarping parameters and in calibrating the frames of reference. Layers with thicknesses as low as 4 nm were successfully mapped. Heterophase interface plane and character distributions (HIPD and HICD, respectively) of Cu and Nb phases from the samples were determined from the orientation maps. In addition, local orientation relation stereograms of the Cu/Nb interfaces were calculated, and these revealed the detailed layer-to-layer texture information. The results are in agreement with previously reported neutron-diffraction-based and precession-electron-diffraction-based measurements on an accumulated roll bonding (ARB)-fabricated Cu/Nb sample with an average layer thickness of 30 nm as well as scanning-electron-microscope-based electron backscattered diffraction HIPD/HICD plots of ARB-fabricated Cu/Nb samples with layer thicknesses between 200 and 600 nm.
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