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Reliability Assessment of Low-Power Processor Packages in Supercomputing Systems

Author(s)
Shin, InsunKwon, Daeil
Issued Date
2016-10-25
URI
https://scholarworks.unist.ac.kr/handle/201301/40971
Citation
The 15th International Symposium on Microelectronics and Packaging
Publisher
Korea Microelectronics Packaging Society

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