Modeling on-board via stubs and traces in high-speed channels for achieving higher data bandwidth
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- Modeling on-board via stubs and traces in high-speed channels for achieving higher data bandwidth
- Han, Ki Jin; Gu, Xiaoxiong; Kwark, Young H.; Shan, Lei; Ritter, Mark B.
- Aggregate data bandwidth; backdrilling; baud rate; channel reach; design guideline; equalization; high-speed links; multilayered board; multiple package modules; parametric simulation; particle swarm optimization (PSO); Serializer/Deserializer (SerDes); transmission line loss; via stub effect
- Issue Date
- IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
- IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.4, no.2, pp.268 - 278
- To achieve a target data bandwidth in high-speed channels, an on-board channel modeling study was presented in this paper. A design guideline was found by observing the variation of link performance, depending on parameters such as channel length, baud rate, and the number of signal layers. The channel performance was investigated using a newly developed parametric simulation environment supported by a fast multilayered via transition modeling tool. The extensive parameter sweep simulations showed that an allowable channel reach has a lower and an upper bound limited by stub via effect and trace loss, respectively. Under a specified channel reach, the aggregate data bandwidths were estimated using a particle swarm optimization routine, and a tradeoff relation among the wiring capability and the maximum allowable data rate was observed. From these observations, the approach provides a guideline to select the number of signal layers for achieving the required data bandwidth.
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