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Lee, Zonghoon
Atomic-Scale Electron Microscopy Lab.
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Tensile behavior of Al1-xMox crystalline and amorphous thin films

Author(s)
Gianola, D. S.Lee, ZonghoonOphus, C.Luber, E. J.Mitlin, D.Dahmen, U.Hemker, K. J.Radmilovic, V. R.
Issued Date
2013-03
DOI
10.1016/j.actamat.2012.11.020
URI
https://scholarworks.unist.ac.kr/handle/201301/3782
Fulltext
http://www.scopus.com/inward/record.url?partnerID=HzOxMe3b&scp=84873701792
Citation
ACTA MATERIALIA, v.61, no.5, pp.1432 - 1443
Abstract
The exceptional strength and distinct deformation physics exhibited by pure ultrafine-grained and nanocrystalline metals in comparison to their microcrystalline counterparts have been ascribed to the dominant influence of grain boundaries in accommodating plastic flow. Such grain-boundary-mediated mechanisms can be augmented by additional strengthening in nanocrystalline alloys via solute and precipitate interactions with dislocations, although its potency is a function of the changes in the elastic properties of the alloyed material. In this study, we investigate the elastic and plastic properties of Al1-xMox alloys (0 <= x <= 0.32) by tensile testing of sputter-deposited freestanding thin films. Isotropic elastic constants and strength are measured over the composition range for which three microstructural regimes are identified, including solid solutions, face-centered cubic and amorphous phase mixtures and body-centered cubic (bcc)/amorphous mixtures. Whereas the bulk modulus is measured to follow the rule of mixtures over the Mo composition range, the Young's and shear moduli do not. Poisson's ratio is non-monotonic with increasing Mo content, showing a discontinuous change at the onset of the bcc/amorphous two-phase region. The strengthening measured in alloyed thin films can be adequately predicted in the solid solution regime only by combining solute strengthening with a grain boundary pinning model. The single-step co-sputtering procedure presented here results in diversity of alloy compositions and microstructures, offering a promising avenue for tailoring the mechanical behavior of thin films.
Publisher
PERGAMON-ELSEVIER SCIENCE LTD
ISSN
1359-6454
Keyword (Author)
Thin filmsMEMS/NEMSAmorphous metalsNanocrystalline metalsElastic properties
Keyword
MOLECULAR-DYNAMICS SIMULATIONGRAIN-BOUNDARY MOTIONELECTRODEPOSITED NANOCRYSTALLINE NICKELSTRAIN-RATE SENSITIVITYMETALLIC-GLASS PLATESMECHANICAL-BEHAVIORROOM-TEMPERATURENANOSTRUCTURED MATERIALSPLASTIC-DEFORMATIONALUMINUM FILMS

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