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Bien, Franklin
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dc.citation.conferencePlace IT -
dc.citation.conferencePlace Florence -
dc.citation.title 2018 IEEE International Symposium on Circuits and Systems, ISCAS 2018 -
dc.contributor.author Choi, EunHo -
dc.contributor.author Kim, SeongMoon -
dc.contributor.author Park, Kyungmin -
dc.contributor.author Bien, Franklin -
dc.contributor.author Kim, Hak Sun -
dc.date.accessioned 2023-12-19T15:48:57Z -
dc.date.available 2023-12-19T15:48:57Z -
dc.date.created 2018-12-04 -
dc.date.issued 2018-05-28 -
dc.description.abstract We propose improved SNR through on-chip Differentially Modulated Signaling with High Voltage (HV) based on Time-Interleaved Sensing Method (TISM) in fingerprint sensing. Tx driver transmits the 0 to 20V-pulse output with proposed signaling into Fingerprint Sensor (FPS), in order to increase the signal to noise ratio (SNR). When capacitance difference of valley-ridge is 0.4fF, the proposed differentially modulated TISM (DM-TISM) signaling is achieved to greater SNR (3.3dB) than that of conventional TISM in performance of fingerprint sensor readout IC architecture, when noise transient is included. Tx driver consists of 4 identical channels. A chip size is 1.3 × 1.1 mm 2 and prototype is fabricated in 0.25-um BCDMOS process. -
dc.identifier.bibliographicCitation 2018 IEEE International Symposium on Circuits and Systems, ISCAS 2018 -
dc.identifier.doi 10.1109/ISCAS.2018.8351239 -
dc.identifier.issn 0271-4310 -
dc.identifier.scopusid 2-s2.0-85049855534 -
dc.identifier.uri https://scholarworks.unist.ac.kr/handle/201301/35198 -
dc.identifier.url https://ieeexplore.ieee.org/document/8351239 -
dc.language 영어 -
dc.publisher Institute of Electrical and Electronics Engineers Inc. -
dc.title Improved SNR, On-Chip Differentially Modulated TISM Signaling in HV DMOS Process for Mutual Capacitance Fingerprint Sensor -
dc.type Conference Paper -
dc.date.conferenceDate 2018-05-27 -

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