Mechanical nano machining of Si wafer by quantitative determination of ductile/brittle-machining transition point

Abstract

Si wafer was mechanically machined at nano scale based on quantitative determination of the ductile/brittle-machining transition point in this study. It was possible to determine the transition point by investigating the abnormal decrease of the cutting force. The machined patterns had sharp V-shapes, which pattern is hard to machine using lithography technology; the patterns had no brittle fractures nor any burrs.