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김진국

Kim, Jingook
Integrated Circuit and Electromagnetic Compatibility Lab.
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dc.citation.conferencePlace US -
dc.citation.conferencePlace Portland, OR -
dc.citation.endPage 112 -
dc.citation.startPage 109 -
dc.citation.title 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems -
dc.contributor.author Kim, Jingook -
dc.contributor.author Kim, Jaemin -
dc.contributor.author Ren, Liehui -
dc.contributor.author Fan, Jun -
dc.contributor.author Kim, Joungho -
dc.contributor.author Drewniak, James L. -
dc.date.accessioned 2023-12-20T04:06:43Z -
dc.date.available 2023-12-20T04:06:43Z -
dc.date.created 2013-07-17 -
dc.date.issued 2009-10-19 -
dc.description.abstract A method to calculate equivalent inductances of multiple vias in arrays has been proposed. The method has been applied to the modeling of a hierarchical power bus and validated by measurements. It is accurate at the frequencies lower than the cavity resonant frequencies. -
dc.identifier.bibliographicCitation 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems, pp.109 - 112 -
dc.identifier.doi 10.1109/EPEPS.2009.5338464 -
dc.identifier.scopusid 2-s2.0-74549162174 -
dc.identifier.uri https://scholarworks.unist.ac.kr/handle/201301/34810 -
dc.identifier.url https://ieeexplore.ieee.org/document/5338464 -
dc.language 영어 -
dc.publisher IEEE -
dc.title Extraction of equivalent inductance in package-PCB hierarchical power distribution network -
dc.type Conference Paper -
dc.date.conferenceDate 2009-10-19 -

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