Atomistic Tight-Binding Study of Contact Resistivity in Si/SiGe PMOS Schottky Contacts

Abstract

The metal-semiconductor contact resistivity has started to play a critical role for the overall device performance as Si is reaching 10-nm size ranges. The International Technology Roadmap for Semiconductors (ITRS) target predicts a requirement of 10 -9 Ω·cm 2 by 2023 which has been a challenging target to achieve. This paper explores the impact of doping concentration, Schottky barrier height, strain, and SiGe mole fraction on the resistivity of Si/SiGe p-type metal-oxide semiconductor (PMOS) contacts with 20-band atomistic tight binding quantum transport simulations. Commonly used simple effective mass approximation models are shown to overestimate the resistivity values. The predicted model results are compared with experimental data and the device parameters needed to achieve 10 -9 Ω·cm 2 are identified.