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dc.citation.endPage 95313 -
dc.citation.startPage 95305 -
dc.citation.title IEEE ACCESS -
dc.citation.volume 7 -
dc.contributor.author Kim, Seungwon -
dc.contributor.author Han, Ki Jin -
dc.contributor.author Kim, Youngmin -
dc.contributor.author Kang, Seokhyeong -
dc.date.accessioned 2023-12-21T18:56:59Z -
dc.date.available 2023-12-21T18:56:59Z -
dc.date.created 2019-08-23 -
dc.date.issued 2019-07 -
dc.description.abstract With the increasing demand for state-of-the-art technologies, such as wearable devices and the Internet of things (IoT), power integrity has emerged as a major concern for high-speed, low-power interfaces that are used as mobile platforms. By using case-specific design models in a high-speed memory system, only a limited analysis of the effects of parametric variations can be performed in complex design problems, such as adjacent voltage domain coupling at high frequencies. Moreover, a conventional industrial method can be simulated only after completing the design layout; therefore, a number of iterative back-annotation processes are required for signoff; this delays the time to market. In this paper, we propose a power integrity coanalysis methodology for multiple power domains in high-frequency memory systems. Our proposed methodology can analyze the tendencies in power integrity by using parametric methods, such as parameter sweeping and Monte Carlo simulations. Our experiments prove that our proposed methodology can predict similar peak-to-peak ripple voltages that are comparable with the realistic simulations of low-power double data rate four interfaces. -
dc.identifier.bibliographicCitation IEEE ACCESS, v.7, pp.95305 - 95313 -
dc.identifier.doi 10.1109/ACCESS.2019.2928896 -
dc.identifier.issn 2169-3536 -
dc.identifier.scopusid 2-s2.0-85070269363 -
dc.identifier.uri https://scholarworks.unist.ac.kr/handle/201301/27493 -
dc.identifier.url https://ieeexplore.ieee.org/document/8763973 -
dc.identifier.wosid 000478676600095 -
dc.language 영어 -
dc.publisher IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC -
dc.title Power Integrity Coanalysis Methodology for Multi-Domain High-Speed Memory Systems -
dc.type Article -
dc.description.isOpenAccess FALSE -
dc.relation.journalWebOfScienceCategory Computer Science, Information Systems; Engineering, Electrical & Electronic; Telecommunications -
dc.relation.journalResearchArea Computer Science; Engineering; Telecommunications -
dc.type.docType Article -
dc.description.journalRegisteredClass scie -
dc.description.journalRegisteredClass scopus -
dc.subject.keywordAuthor Power integrity (PI) -
dc.subject.keywordAuthor multi-domain coupling -
dc.subject.keywordAuthor high-speed memory -
dc.subject.keywordAuthor power delivery system -
dc.subject.keywordAuthor power distribution network (PDN) -
dc.subject.keywordAuthor chip-package-PCB coanalysis -
dc.subject.keywordAuthor analysis methodology -
dc.subject.keywordAuthor low power double data rate four (LPDDR4) -
dc.subject.keywordPlus SIMULATION -
dc.subject.keywordPlus PACKAGE -
dc.subject.keywordPlus DESIGN -

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