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Author

Park, Jang-Ung
Flexible Nano-electronics & Biotechnology Lab
Research Interests
  • Wireless wearable electronics, flexible electronics, printed electronics, nano-bio interfaces

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Air-stable, surface-oxide free Cu nanoparticles for highly conductive Cu ink and their application to printed graphene transistors

Cited 14 times inthomson ciCited 6 times inthomson ci
Title
Air-stable, surface-oxide free Cu nanoparticles for highly conductive Cu ink and their application to printed graphene transistors
Author
Jeong, SunhoLee, Su HyeonJo, YejinLee, Sun SookSeo, Yeong-HuiAhn, Byeong WanKim, GyeomukJang, Gun-EikPark, Jang-UngRyu, Beyong-HwanChoi, Youngmin
Keywords
Capping molecules; Chemical interactions; Graphene transistors; Ink-jet technique; Printed electronics; Solution-processed; Surface oxide layer; Surface protection
Issue Date
201304
Publisher
ROYAL SOC CHEMISTRY
Citation
JOURNAL OF MATERIALS CHEMISTRY C, v.1, no.15, pp.2704 - 2710
Abstract
Air-stable, surface-oxide free Cu nanoparticles are, for the first time, synthesized by surrounding completely the Cu surface with oleic acid incorporated as a capping molecule. XPS analysis, in conjunction with TEM analysis, revealed that the oleic acid is chemisorbed to the Cu surface via a chemical interaction wherein a monodentate bond is included, without leaving behind free (non-interacting) oleic acid, thereby providing complete surface protection against oxidation. By eliminating the surface oxide layer that critically degrades the electrical properties, the surface-oxide free Cu nanoparticle ink facilitates the realization of a solution-processed Cu electrode layer with resistivity as low as 4 mu Omega cm, comparable to the resistivity of noble metal-based, solution-processed counterparts. In addition, high resolution Cu electrode patterns with 5 mu m line-width are directly printed using an electrohydrodynamic inkjet technique, and graphene transistors with the printed Cu electrodes demonstrate potential applications in printed electronics.
URI
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DOI
http://dx.doi.org/10.1039/c3tc00904a
ISSN
2050-7526
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