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Bien, Franklin
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Fully integrated UHF RFID mobile reader with power amplifiers using System-in-Package (SiP)

Author(s)
Yang, HyeminKim, JongmoonBien, FranklinLee, Jongsoo
Issued Date
2011-01
DOI
10.1587/elex.8.83
URI
https://scholarworks.unist.ac.kr/handle/201301/2584
Fulltext
http://www.scopus.com/inward/record.url?partnerID=HzOxMe3b&scp=79751510026
Citation
IEICE ELECTRONICS EXPRESS, v.8, no.2, pp.83 - 88
Abstract
A fully integrated system-in-package (SiP) for UHF (860-960 MHz) RFID mobile reader is presented. The SiP is made up of an UHF transceiver, a power amplifier (PA), and two baluns. The UHF transceiver was designed in TSMC 0.18 mu m Si CMOS and the PA was developed with InGaP/GaAs hetero-junction-bipolar transistor (HBT) technology. The transceiver IC is fully integrated for mobile UHF RFID applications and the PA has high efficiency and linearity with 24 dBm output power for wireless RFID communications over a distance of 1 m. The total size of the SiP module is 11 mm x 11 mm. The measured data show a transmitter gain of 19.2 dB, total current of 253 mA and adjacent channel power ratio (ACPR) of -41.8 dBc with the second harmonic performance of -57.6 dBc. Also, TX-RX leakage was reduced by careful power amplifier and board designs in small SIP module implementation.
Publisher
IEICE-INST ELECTRONICS INFORMATION COMMUNICATIONS ENG
ISSN
1349-2543

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