Full metadata record
DC Field | Value | Language |
---|---|---|
dc.citation.number | 5 | - |
dc.citation.startPage | 176 | - |
dc.citation.title | METALS | - |
dc.citation.volume | 7 | - |
dc.contributor.author | Nam, Hyun Min | - |
dc.contributor.author | Seo, Duck Min | - |
dc.contributor.author | Yun, Hyung Duk | - |
dc.contributor.author | Thangavel, Gurunathan | - |
dc.contributor.author | Park, Lee Soon | - |
dc.contributor.author | Nam, Su Yong | - |
dc.date.accessioned | 2023-12-21T22:13:56Z | - |
dc.date.available | 2023-12-21T22:13:56Z | - |
dc.date.created | 2017-07-05 | - |
dc.date.issued | 2017-05 | - |
dc.description.abstract | Transparent conducting electrode film is highly desirable for application in touch screen panels (TSPs), flexible and wearable displays, sensors, and actuators. A sputtered film of indium tin oxide (ITO) shows high transmittance (90%) at low sheet resistance (50 Ω/cm2). However, ITO films lack mechanical flexibility, especially under bending stress, and have limitation in application to large-area TSPs (over 15 inches) due to the trade-off in high transmittance and low sheet resistance properties. One promising solution is to use metal mesh-type transparent conducting film, especially for touch panel application. In this work, we investigated such inter-related issues as UV imprinting process to make a trench layer pattern, the synthesis of core-shell-type Ag and Cu@Ag composite nanoparticles and their paste formulation, the filling of Ag and Cu@Ag mixture nanoparticle paste to the trench layer, and touch panel fabrication processes. | - |
dc.identifier.bibliographicCitation | METALS, v.7, no.5, pp.176 | - |
dc.identifier.doi | 10.3390/met7050176 | - |
dc.identifier.issn | 2075-4701 | - |
dc.identifier.scopusid | 2-s2.0-85019945313 | - |
dc.identifier.uri | https://scholarworks.unist.ac.kr/handle/201301/22319 | - |
dc.identifier.url | http://www.mdpi.com/2075-4701/7/5/176 | - |
dc.identifier.wosid | 000404052600025 | - |
dc.language | 영어 | - |
dc.publisher | MDPI AG | - |
dc.title | Transparent conducting film fabricated by metal mesh method with Ag and cu@ag mixture nanoparticle pastes | - |
dc.type | Article | - |
dc.description.isOpenAccess | TRUE | - |
dc.relation.journalWebOfScienceCategory | Materials Science, Multidisciplinary; Metallurgy & Metallurgical Engineering | - |
dc.relation.journalResearchArea | Materials Science; Metallurgy & Metallurgical Engineering | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.subject.keywordAuthor | synthesis of core-shell metal nanoparticles | - |
dc.subject.keywordAuthor | Cu@Ag composite nanoparticle | - |
dc.subject.keywordAuthor | metal mesh | - |
dc.subject.keywordAuthor | screen printing | - |
dc.subject.keywordAuthor | touch screen panel | - |
dc.subject.keywordPlus | ELECTRONICS | - |
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