File Download

There are no files associated with this item.

  • Find it @ UNIST can give you direct access to the published full text of this article. (UNISTARs only)
Related Researcher

이재선

Lee, Jaeseon
Innovative Thermal Engineering Lab.
Read More

Views & Downloads

Detailed Information

Cited time in webofscience Cited time in scopus
Metadata Downloads

Full metadata record

DC Field Value Language
dc.citation.endPage 465 -
dc.citation.number 2 -
dc.citation.startPage 453 -
dc.citation.title IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES -
dc.citation.volume 32 -
dc.contributor.author Lee, Jaeseon -
dc.contributor.author Mudawar, Issam -
dc.date.accessioned 2023-12-22T08:06:11Z -
dc.date.available 2023-12-22T08:06:11Z -
dc.date.created 2016-01-20 -
dc.date.issued 2009-06 -
dc.description.abstract For a given heat sink thermal resistance and ambient temperature, the temperature of an electronic device rises fairly linearly with increasing device heat flux. This relationship is especially problematic for defense electronics, where heat dissipation is projected to exceed 1000 W/cm2 in the near future. Direct and indirect low-temperature refrigeration cooling facilitate appreciable reduction in the temperature of both coolant and device. This paper explores the benefits of cooling the device using direct and indirect refrigeration cooling systems. In the direct cooling system, a microchannel heat sink serves as an evaporator in a conventional vapor compression cycle using R134a as working fluid. In the indirect cooling system, HFE 7100 is used to cool the heat sink in a primary pumped liquid loop that rejects heat to a secondary refrigeration loop. Two drastically different flow behaviors are observed in these systems. Because of compressor performance constraints, mostly high void fraction two-phase patterns are encountered in the R134a system, dominated by saturated boiling. On the other hand, the indirect refrigeration cooling system facilitates highly subcooled boiling inside the heat sink. Both systems are shown to provide important cooling benefits, but the indirect cooling system is far more effective at dissipating high heat fluxes. Tests with this system yielded cooling heat fluxes as high as 840 W/cm2 without incurring critical heat flux (CHF). Results from both systems are combined to construct an overall map of performance trends relative to mass velocity, subcooling, pressure, and surface tension. Extreme conditions of near-saturated flow, low mass velocity, and low pressure produce ldquomicrordquo behavior, where macrochannel flow pattern maps simply fail to apply, instabilities are prominent, and CHF is quite low. One the other hand, systems with high mass velocity, high subcooling, and high pressure are far more stable and y- - ield very high CHF values; two-phase flow in these systems follows the fluid flow and heat transfer behavior as well as the flow pattern maps of macrochannels. -
dc.identifier.bibliographicCitation IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.32, no.2, pp.453 - 465 -
dc.identifier.doi 10.1109/TCAPT.2008.2005783 -
dc.identifier.issn 1521-3331 -
dc.identifier.scopusid 2-s2.0-68349139340 -
dc.identifier.uri https://scholarworks.unist.ac.kr/handle/201301/18397 -
dc.identifier.url http://ieeexplore.ieee.org/document/4776423/ -
dc.identifier.wosid 000268282800027 -
dc.language 영어 -
dc.publisher Institute of Electrical and Electronics Engineers -
dc.title Low-temperature two-phase microchannel cooling for high-heat-flux thermal management of defense electronics -
dc.type Article -
dc.description.journalRegisteredClass scie -
dc.description.journalRegisteredClass scopus -

qrcode

Items in Repository are protected by copyright, with all rights reserved, unless otherwise indicated.