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Author

Park, Lee Soon
School of Materials Science and Engineering
Research Interests
  • Flexible OLED new materials, process and fabrication

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Layer Encapsulation of Quantum Dots on Chip on Board Type White LEDs

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Title
Layer Encapsulation of Quantum Dots on Chip on Board Type White LEDs
Author
Kwak, Seong KwonYoo, Tae WookKim, Bo-SungLee, Sang MunKim, Seok WonLee, Dong WookHur, YoungjunePark, Lee Soon
Keywords
Light emitting diode; LED; encapsulation; chip on board; MCPCB; LIGHT EMISSION; RESISTANCE; DIODES
Issue Date
2012
Publisher
TAYLOR & FRANCIS LTD
Citation
MOLECULAR CRYSTALS AND LIQUID CRYSTALS, v.564, no., pp.18 - 25
Abstract
The chip on board (COB) types LED modules were fabricated by using metal core printed circuit board (mcPCB), aluminium oxide (Al2O3) and aluminium nitride (AlN) as submounts of LED chips. The radiant flux of the LEDs exhibited slight difference in terms of the LED chip bonding process in which eutectic bonding gave higher radiant flux than Ag epoxy bonding in both AlN and Al2O3 substrates. However the LED modules fabricated on AlN ceramic substrate exhibited higher radiant flux than the one on Al2O3 substrate at high current due to more effective heat dissipation in case of AlN substrate. The WLED modules encapsulated with YAG phosphor and red QD by layer-by-layer mode showed both high total luminous flux and high color rendering index
URI
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DOI
http://dx.doi.org/10.1080/15421406.2012.690642
ISSN
1542-1406
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