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신태주

Shin, Tae Joo
Synchrotron Radiation Research Lab.
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Residual stress behavior in methylsilsesquioxane-based dielectric thin films

Author(s)
Oh, WShin, Tae JooRee, MJin, MYChar, K
Issued Date
2001-04
DOI
10.1080/10587250108024768
URI
https://scholarworks.unist.ac.kr/handle/201301/16640
Fulltext
http://www.tandfonline.com/doi/abs/10.1080/10587250108024768#.VekDOyXtlBc
Citation
MOLECULAR CRYSTALS AND LIQUID CRYSTALS, v.371, pp.397 - 402
Abstract
Residual stress of methylsilsequioxane film, which was spin-coated on silicon substrate and followed by soft-baking, was measured in-situ during curing and subsequent cooling with varying processing conditions. The thickness and refractive index of the cured films were measured using ellipsometry. Their structure was also examined by Xray diffraction
Publisher
TAYLOR & FRANCIS LTD
ISSN
1542-1406

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