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dc.citation.endPage 835 -
dc.citation.number 3 -
dc.citation.startPage 831 -
dc.citation.title JOURNAL OF ELECTRONIC MATERIALS -
dc.citation.volume 44 -
dc.contributor.author Song, WON-SEOK -
dc.contributor.author Kim, SEUNG-GYU -
dc.contributor.author Kim, Young-Cheon -
dc.contributor.author Kwon, DONGIL -
dc.date.accessioned 2023-12-22T01:38:13Z -
dc.date.available 2023-12-22T01:38:13Z -
dc.date.created 2015-01-26 -
dc.date.issued 2015-03 -
dc.description.abstract In this paper we propose a novel method, spherical indentation, for evaluation of the plastic properties of combined structures. Three-dimensional (3D) printed products, for example gradient metal alloys consisting of different kinds of material, contain interfaces that can act as weak points and threaten the mechanical reliability of products. Combined structures containing an interface between Cu alloy and Ag were prepared for testing. Samples were heat-treated at 100°C and 200°C for 3 h to optimize processing conditions. The indentation tensile properties of the samples were estimated by analyzing multiple loading-unloading curves obtained by use of the representative stress and strain method. A continuous increase in both yield strength and tensile strength was observed for the Cu alloy and the Cu/Ag interface after heat treatment at up to 200°C, because of precipitation hardening. These experimental results show that mechanical characterization of combined structures by spherical indentation is highly useful on the nano and micro scales. -
dc.identifier.bibliographicCitation JOURNAL OF ELECTRONIC MATERIALS, v.44, no.3, pp.831 - 835 -
dc.identifier.doi 10.1007/s11664-014-3593-4 -
dc.identifier.issn 0361-5235 -
dc.identifier.scopusid 2-s2.0-84925519342 -
dc.identifier.uri https://scholarworks.unist.ac.kr/handle/201301/11201 -
dc.identifier.url http://link.springer.com/article/10.1007%2Fs11664-014-3593-4 -
dc.identifier.wosid 000349442100009 -
dc.language 영어 -
dc.publisher SPRINGER -
dc.title Use of Spherical Instrumented Indentation to Evaluate the Tensile Properties of 3D Combined Structures -
dc.type Article -
dc.description.isOpenAccess FALSE -
dc.relation.journalWebOfScienceCategory Engineering, Electrical & Electronic; Materials Science, Multidisciplinary; Physics, Applied -
dc.relation.journalResearchArea Engineering; Materials Science; Physics -
dc.description.journalRegisteredClass scie -
dc.description.journalRegisteredClass scopus -
dc.subject.keywordAuthor Spherical indentation -
dc.subject.keywordAuthor tensile properties -
dc.subject.keywordAuthor representative stress and strain -
dc.subject.keywordAuthor combined structure -
dc.subject.keywordPlus REPRESENTATIVE STRESS -
dc.subject.keywordPlus RESIDUAL-STRESSES -
dc.subject.keywordPlus STRAIN -
dc.subject.keywordPlus LOAD -
dc.subject.keywordPlus NANOINDENTATION -

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